Laramlisure LED CORN LAMP 330 Degree Lighting The reliability o

  • The reliability (life) of LED CORN LAMP 330 Degree Lighting depends largely on the level of heat dissipation, so improving the heat dissipation level is one of the key technologies. It is mainly to solve the excess heat from the chip to spread through the heat sink and heat dissipation. This is a very complicated technical problem.

    The power of LED lamps, which LEDs need to consider the heat dissipation problem, and the power LED needs to heat dissipation. Power LED refers to the light emitting diode with a working current above 100mA. It is defined by the corn lamp accessories manufacturer with reference to the American Assist alliance, and the typical value of the two positive voltage of two LEDs is 2.1V and 3.3V, that is, the input power of 210MW and 330MW is all power LEDs. Some people may have different views, but practice has proved that to improve the reliability (life) of power LED, the heat dissipation problem of power LED must be considered.

    The main parameters related to heat dissipation related parameters include heat resistance, knot temperature and temperature rise, etc.

    The thermal resistance refers to the fact that the valid temperature of the device and the external regulation reference point temperature is removed from the quotient of the steady -state power in the device. It is an important parameter that represents the degree of device heat dissipation. At present, the power LED heat resistance ≤ 10 ℃/w is the heat resistance of domestic reports, and domestic reports are ≤5 ° C/W. Foreign heat resistance ≤3 ℃/w can ensure the life of the power LED.

    The knot temperature is the temperature of the semiconductor conclusion of the main heating part of the corn lamp accessories in the corn lamp accessories. It is the temperature value that the LED devices can bear under working conditions. To this end, the US SSL program sets the goal of improving heat resistance. The heat resistance of chips and fluorescent powder is still very high. At present, the chip knot temperature has been reached at 150 ° C, and the fluorescent powder is basically at 130 ° C. It will basically not affect the life of the device. The higher the heat resistance of the chip fluorescent powder, the lower the requirements for heat dissipation.

    There are several different temperature rise in Wen Sheng. What we discuss here is: tube shell -environment temperature rise. It refers to the difference between the temperature and environment of the LED device tube shell (the LED lamp can measure) temperature and environment (on the light of the lamp light, 0.5 meters away from the lamp). It is a temperature value that can be directly measured and can directly reflect the degree of heat dissipation peripherals of LED devices. Practice has proven that when the ambient temperature is 30 ° C, if the LED tube shell is measured at 60 ° C, the temperature rise should be 30 ° C at 30 ° C. At this time, it can basically ensure the life value of the LED device. If the temperature rise is too high, the maintenance rate of LED light sources will decrease significantly.

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